Junction Semiconductor

Advanced Semiconductor Technology & Lithography

EUV Lithography and High-NA Innovation: Analyzed ASML EUV roadmap, including High-NA deployment scenarios and alternative sub-EUV light sources (e.g., atom lithography, FEL). Quantified productivity, cost, and power scaling implications in GAA and 3D DRAM era.Advanced Lithography Technologies: Benchmarked LPP vs. LDP, evaluated overlay/metrology tradeoffs, and explored feasibility of alternative litho paths. Created roadmap visualizations for sub-2nm patterning.

Packaging, 3D Integration & Interconnect

2.xD/3D RDL and PLP Packaging: Evaluated RDL warpage, yield modeling, HRDP vs. SAP tradeoffs on 500mm+ substrates. Reviewed materials and process flow for molded RDL and panel-level packaging.CIS Packaging and Glass Cap Integration: Assessed CSP/WLCSP reliability tradeoffs, glass capping adoption. Compared resin vs. glass transmission, height constraints, and supplier ecosystem.Polyimide and Film Materials for Packaging: Studied PI thermal stability and delamination in molding/PLP. Modeled demand trends across memory, logic, CIS, and flexible electronics.

AI Infrastructure & Optical Networking

Optical DSP and Strategy Analyzed SerDes/AEC architecture adoption by hyperscalers. Compared LPO, CPO readiness, and packaging implications for GPU cluster scaling.MCP & Inference Infrastructure Modeling Built compute/memory/network architecture stack to support GenAI workloads. Explored emerging disaggregation protocols and monitoring strategies.

Memory & HBM Stack Analysis

HBM Technology Differentiation Compared TSV pitch, stack height, process yield, and underfill reliability. Benchmarked CXL and NVLink integration scenarios for future HBM/CXL hybrid memory pooling.Non-Volatile Memory Trends (FRAM, MRAM, ReRAM) Quantified scaling, endurance, and BEOL integration issues. Evaluated FRAM maturity vs. MRAM in embedded memory market.

Foundry Race Analysis Created node roadmap timeline to 1.4nm, comparing gate pitch, BEOL scaling, and EUV insertion points. Integrated investment and technology cadence.Fabless-to-Foundry Transfer & Foundry Economics Modeled yield, equipment cost, and risk-sharing structure across TSMC, Samsung, Intel. Explored China foundry rise and onboarding implications.

Foundry Strategy, Yield & Fab Modeling

Materials & Cross-Vertical Applications

Flexible Substrates, Sensors & MEMS Integration Explored lift-off MEMS, magnetic sensors, and laser alignment integration in low-temperature process stacks. Assessed carbon thin film and specialty glass applications.SiC MOSFET & Advanced Power Packaging Evaluated Through-Dielectric Interconnect (TDI) path to cost reduction. Mapped competitive structure for SiC-based automotive and datacenter components.